Damage progression in BGA solder joints during board-level drop test
This study examines the dynamic fracture propagation experienced by critical solder joints in a BGA test package during board-level single drop test. An Input-G loading method is employed to simulate a drop test condition with a peak acceleration of 1500G within a time duration of 0.5 ms. Unifie...
Main Authors: | Yamin, A.F.M., Shaffiar, Norhashimah, Loh, W.K., Tamin, M.N. |
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Format: | Conference or Workshop Item |
Language: | English |
Published: |
2011
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Subjects: | |
Online Access: | http://irep.iium.edu.my/39332/ http://irep.iium.edu.my/39332/1/EPTC_Damage_Progression_in_BGA_Solder_Joints_during_Board-Level_Drop_Test.pdf |
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