Evaluation of the effects of copper electroplating parameters on the adhesion using response surface methodology

In this paper, response surface methodology (RSM) was utilized for the experiment design of CuSO4 and H2SO4 concentrations and current densities. RSM was also used to evaluate the significance of each parameter and its interaction on the adhesion strength of austenitic stainless steel substrate. Adh...

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Main Authors:	Mohamed Haider, Farag I., ,, Suryanto, Ani, Mohd Hanafi, Mahmood, Mahmood Hameed
Format:	Article
Language:	English
Published:	Trans Tech Publications 2017
Subjects:	TA401 Materials of engineering and construction
Online Access:	http://irep.iium.edu.my/55777/ http://irep.iium.edu.my/55777/ http://irep.iium.edu.my/55777/ http://irep.iium.edu.my/55777/1/AMM.864.121.pdf

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recordtype	eprints
spelling	iium-557772018-02-04T11:02:37Z http://irep.iium.edu.my/55777/ Evaluation of the effects of copper electroplating parameters on the adhesion using response surface methodology Mohamed Haider, Farag I. ,, Suryanto Ani, Mohd Hanafi Mahmood, Mahmood Hameed TA401 Materials of engineering and construction In this paper, response surface methodology (RSM) was utilized for the experiment design of CuSO4 and H2SO4 concentrations and current densities. RSM was also used to evaluate the significance of each parameter and its interaction on the adhesion strength of austenitic stainless steel substrate. Adhesion strength was investigated by a Teer ST-30 tester, and the structure of the samples investigated by using scanning electron microscopy (SEM). Results showed that increasing the concentration of CuSO4 and decreasing that of H2SO4 strengthens adhesion. Conversely, the current density only has a slight effect. Trans Tech Publications 2017-04-27 Article PeerReviewed application/pdf en http://irep.iium.edu.my/55777/1/AMM.864.121.pdf Mohamed Haider, Farag I. and ,, Suryanto and Ani, Mohd Hanafi and Mahmood, Mahmood Hameed (2017) Evaluation of the effects of copper electroplating parameters on the adhesion using response surface methodology. Applied Mechanics and Materials, 864. pp. 121-126. ISSN 1662-7482 http://www.scientific.net doi:10.4028/www.scientific.net/AMM.864.121
repository_type	Digital Repository
institution_category	Local University
institution	International Islamic University Malaysia
building	IIUM Repository
collection	Online Access
language	English
topic	TA401 Materials of engineering and construction
spellingShingle	TA401 Materials of engineering and construction Mohamed Haider, Farag I. ,, Suryanto Ani, Mohd Hanafi Mahmood, Mahmood Hameed Evaluation of the effects of copper electroplating parameters on the adhesion using response surface methodology
description	In this paper, response surface methodology (RSM) was utilized for the experiment design of CuSO4 and H2SO4 concentrations and current densities. RSM was also used to evaluate the significance of each parameter and its interaction on the adhesion strength of austenitic stainless steel substrate. Adhesion strength was investigated by a Teer ST-30 tester, and the structure of the samples investigated by using scanning electron microscopy (SEM). Results showed that increasing the concentration of CuSO4 and decreasing that of H2SO4 strengthens adhesion. Conversely, the current density only has a slight effect.
format	Article
author	Mohamed Haider, Farag I. ,, Suryanto Ani, Mohd Hanafi Mahmood, Mahmood Hameed
author_facet	Mohamed Haider, Farag I. ,, Suryanto Ani, Mohd Hanafi Mahmood, Mahmood Hameed
author_sort	Mohamed Haider, Farag I.
title	Evaluation of the effects of copper electroplating parameters on the adhesion using response surface methodology
title_short	Evaluation of the effects of copper electroplating parameters on the adhesion using response surface methodology
title_full	Evaluation of the effects of copper electroplating parameters on the adhesion using response surface methodology
title_fullStr	Evaluation of the effects of copper electroplating parameters on the adhesion using response surface methodology
title_full_unstemmed	Evaluation of the effects of copper electroplating parameters on the adhesion using response surface methodology
title_sort	evaluation of the effects of copper electroplating parameters on the adhesion using response surface methodology
publisher	Trans Tech Publications
publishDate	2017
url	http://irep.iium.edu.my/55777/ http://irep.iium.edu.my/55777/ http://irep.iium.edu.my/55777/ http://irep.iium.edu.my/55777/1/AMM.864.121.pdf
first_indexed	2023-09-18T21:18:44Z
last_indexed	2023-09-18T21:18:44Z
_version_	1777411738674659328

Evaluation of the effects of copper electroplating parameters on the adhesion using response surface methodology

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