Modelling and optimization of copper electroplating adhesion strength
In this paper, Response surface methodology (RSM) was utilized to design the experiments at the settings of CuSO4 and H2SO4 concentrations and current densities. It also used for modelling and optimize the parameters on the adhesion strength of austenitic stainless steel substrate. The adhesion stre...
| Main Authors: | , , , |
|---|---|
| Format: | Article |
| Language: | English English English |
| Published: |
Institute of Physics
2017
|
| Subjects: | |
| Online Access: | http://irep.iium.edu.my/55778/ http://irep.iium.edu.my/55778/ http://irep.iium.edu.my/55778/1/Modelling%20and%20Optimization.pdf http://irep.iium.edu.my/55778/7/55778_Modelling%20and%20Optimization%20of%20Copper_SCOPUS.pdf http://irep.iium.edu.my/55778/13/55778%20Modelling%20and%20optimization%20of%20copper%20electroplating%20WOS.pdf |
Internet
http://irep.iium.edu.my/55778/http://irep.iium.edu.my/55778/
http://irep.iium.edu.my/55778/1/Modelling%20and%20Optimization.pdf
http://irep.iium.edu.my/55778/7/55778_Modelling%20and%20Optimization%20of%20Copper_SCOPUS.pdf
http://irep.iium.edu.my/55778/13/55778%20Modelling%20and%20optimization%20of%20copper%20electroplating%20WOS.pdf