-, S., Haider, F., Ani, M. H., & Mahmood, M. H. (2017). Modelling and optimization of copper electroplating adhesion strength. Institute of Physics.
Chicago Style (17th ed.) Citation-, Suryanto, Farag Haider, Mohd Hanafi Ani, and Mahmood Hameed Mahmood. Modelling and Optimization of Copper Electroplating Adhesion Strength. Institute of Physics, 2017.
MLA (8th ed.) Citation-, Suryanto, et al. Modelling and Optimization of Copper Electroplating Adhesion Strength. Institute of Physics, 2017.
Warning: These citations may not always be 100% accurate.