Intermetallic thickness and physical studies of Sn-3.5Ag-1.0Cu lead free solder with ni addition / Noor Asikin Ab Ghani
Due to the environmental and health concern, the use o f lead free solder has been introduced in 2000 by National Electronics Manufacturing Initiative (NEMI) to replace the tin-lead (Sn-Pb) solder. Among many lead free solders, the tin-silvercopper (Sn-3.5Ag-l.0Cu) is a potential replacement for Sn-...
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| Format: | Thesis |
| Language: | English |
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2016
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| Online Access: | http://ir.uitm.edu.my/id/eprint/27206/ http://ir.uitm.edu.my/id/eprint/27206/1/TM_NOOR%20ASIKIN%20AB%20GHANI%20AS%2016_5.pdf |