Intermetallic thickness and physical studies of Sn-3.5Ag-1.0Cu lead free solder with ni addition / Noor Asikin Ab Ghani

Intermetallic thickness and physical studies of Sn-3.5Ag-1.0Cu lead free solder with ni addition / Noor Asikin Ab Ghani

Due to the environmental and health concern, the use o f lead free solder has been introduced in 2000 by National Electronics Manufacturing Initiative (NEMI) to replace the tin-lead (Sn-Pb) solder. Among many lead free solders, the tin-silvercopper (Sn-3.5Ag-l.0Cu) is a potential replacement for Sn-...

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Main Author: Ab Ghani, Noor Asikin
Format: Thesis
Language:English
Published: 2016
Subjects:
Electricity and magnetism
Online Access:http://ir.uitm.edu.my/id/eprint/27206/
http://ir.uitm.edu.my/id/eprint/27206/1/TM_NOOR%20ASIKIN%20AB%20GHANI%20AS%2016_5.pdf
id uitm-27206
recordtype eprints
spelling uitm-272062020-01-14T03:33:02Z http://ir.uitm.edu.my/id/eprint/27206/ Intermetallic thickness and physical studies of Sn-3.5Ag-1.0Cu lead free solder with ni addition / Noor Asikin Ab Ghani Ab Ghani, Noor Asikin Electricity and magnetism Due to the environmental and health concern, the use o f lead free solder has been introduced in 2000 by National Electronics Manufacturing Initiative (NEMI) to replace the tin-lead (Sn-Pb) solder. Among many lead free solders, the tin-silvercopper (Sn-3.5Ag-l.0Cu) is a potential replacement for Sn-Pb because it has a good compatibility with common commercial components and low melting point compared with other lead free solders. This research was carried out to study the properties of Sn-3.5Ag-l.0Cu solder by adding three different amount o f Ni into the solder which was characterized for its melting temperature, density and hardness test. The melted solder was aged in an oven until 1000 h for intermetallic and joint strength study. Intermetallic formation was analyzed under the Scanning Electron Microscope (SEM) and Energy Dispersive X-ray (EDX). Shear joint sample was tested using an instron machine. The onset temperature slightly increases to 220.3°C and liquidus temperature and pasty range decrease to 233.6°C and 13.3°C. 2 h mixing time and 14 MPa pressure are an optimum condition for sample preparation. The addition o f Ni retards the growth o f intermetallic with 0.05 wt.% Ni the most significant value compared to 0.2 and 0.5 wt.% Ni. 0.05 and 0.2 wt.% Ni give the smallest and similar total growth rate constant (A) which is 10.240x1 O'14 cm2/s. Smallest growth rate values indicate the smallest diffusion coefficient reaction between solder and substrate during aging process, retards the intermetallic thickness which influence solder joint strength. Stress and strain values increase with the decreasing o f intermetallic thickness. 0.05 wt.% Ni has the highest stress and strain values which are 21.52 MPa and 0.118. 2016-06 Thesis NonPeerReviewed text en http://ir.uitm.edu.my/id/eprint/27206/1/TM_NOOR%20ASIKIN%20AB%20GHANI%20AS%2016_5.pdf Ab Ghani, Noor Asikin (2016) Intermetallic thickness and physical studies of Sn-3.5Ag-1.0Cu lead free solder with ni addition / Noor Asikin Ab Ghani. Masters thesis, Universiti Teknologi MARA.
repository_type Digital Repository
institution_category Local University
institution Universiti Teknologi MARA
building UiTM Institutional Repository
collection Online Access
language English
topic Electricity and magnetism
spellingShingle Electricity and magnetism
Ab Ghani, Noor Asikin
Intermetallic thickness and physical studies of Sn-3.5Ag-1.0Cu lead free solder with ni addition / Noor Asikin Ab Ghani
description Due to the environmental and health concern, the use o f lead free solder has been introduced in 2000 by National Electronics Manufacturing Initiative (NEMI) to replace the tin-lead (Sn-Pb) solder. Among many lead free solders, the tin-silvercopper (Sn-3.5Ag-l.0Cu) is a potential replacement for Sn-Pb because it has a good compatibility with common commercial components and low melting point compared with other lead free solders. This research was carried out to study the properties of Sn-3.5Ag-l.0Cu solder by adding three different amount o f Ni into the solder which was characterized for its melting temperature, density and hardness test. The melted solder was aged in an oven until 1000 h for intermetallic and joint strength study. Intermetallic formation was analyzed under the Scanning Electron Microscope (SEM) and Energy Dispersive X-ray (EDX). Shear joint sample was tested using an instron machine. The onset temperature slightly increases to 220.3°C and liquidus temperature and pasty range decrease to 233.6°C and 13.3°C. 2 h mixing time and 14 MPa pressure are an optimum condition for sample preparation. The addition o f Ni retards the growth o f intermetallic with 0.05 wt.% Ni the most significant value compared to 0.2 and 0.5 wt.% Ni. 0.05 and 0.2 wt.% Ni give the smallest and similar total growth rate constant (A) which is 10.240x1 O'14 cm2/s. Smallest growth rate values indicate the smallest diffusion coefficient reaction between solder and substrate during aging process, retards the intermetallic thickness which influence solder joint strength. Stress and strain values increase with the decreasing o f intermetallic thickness. 0.05 wt.% Ni has the highest stress and strain values which are 21.52 MPa and 0.118.
format Thesis
author Ab Ghani, Noor Asikin
author_facet Ab Ghani, Noor Asikin
author_sort Ab Ghani, Noor Asikin
title Intermetallic thickness and physical studies of Sn-3.5Ag-1.0Cu lead free solder with ni addition / Noor Asikin Ab Ghani
title_short Intermetallic thickness and physical studies of Sn-3.5Ag-1.0Cu lead free solder with ni addition / Noor Asikin Ab Ghani
title_full Intermetallic thickness and physical studies of Sn-3.5Ag-1.0Cu lead free solder with ni addition / Noor Asikin Ab Ghani
title_fullStr Intermetallic thickness and physical studies of Sn-3.5Ag-1.0Cu lead free solder with ni addition / Noor Asikin Ab Ghani
title_full_unstemmed Intermetallic thickness and physical studies of Sn-3.5Ag-1.0Cu lead free solder with ni addition / Noor Asikin Ab Ghani
title_sort intermetallic thickness and physical studies of sn-3.5ag-1.0cu lead free solder with ni addition / noor asikin ab ghani
publishDate 2016
url http://ir.uitm.edu.my/id/eprint/27206/
http://ir.uitm.edu.my/id/eprint/27206/1/TM_NOOR%20ASIKIN%20AB%20GHANI%20AS%2016_5.pdf
first_indexed 2023-09-18T23:18:00Z
last_indexed 2023-09-18T23:18:00Z
_version_ 1777419241801121792

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