Development of Diffusion Barrier Layer on Copper-Printed Circuit Board Using Electroless Plating Method

Development of Diffusion Barrier Layer on Copper-Printed Circuit Board Using Electroless Plating Method

In this paper, the nickel–phosphorus (Ni–P) diffusion barrier layer between Sn–4Ag–0.5Cu solder alloy and copper-printed circuit board was developed. The electroless plating technique was used to develop Ni–P diffusion barrier layer with different percentage of phosphorus content, which are 1–5 wt...

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Main Authors: Siti Rabiatull Aisha, Idris, Ourdjini, Ali, Azmah Hanim, Mohamad Ariff, Saliza Azlina, Osman
Format: Article
Language:English
English
Published: Wessex Institute of Technology 2015
Subjects:
TA Engineering (General). Civil engineering (General)
TN Mining engineering. Metallurgy
Online Access:http://umpir.ump.edu.my/id/eprint/11846/
http://umpir.ump.edu.my/id/eprint/11846/
http://umpir.ump.edu.my/id/eprint/11846/
http://umpir.ump.edu.my/id/eprint/11846/1/CMEM030404f.pdf
http://umpir.ump.edu.my/id/eprint/11846/7/fkm-2015-aisha-development%20of%20diffusion.pdf
id ump-11846
recordtype eprints
spelling ump-118462018-01-15T07:44:11Z http://umpir.ump.edu.my/id/eprint/11846/ Development of Diffusion Barrier Layer on Copper-Printed Circuit Board Using Electroless Plating Method Siti Rabiatull Aisha, Idris Ourdjini, Ali Azmah Hanim, Mohamad Ariff Saliza Azlina, Osman TA Engineering (General). Civil engineering (General) TN Mining engineering. Metallurgy In this paper, the nickel–phosphorus (Ni–P) diffusion barrier layer between Sn–4Ag–0.5Cu solder alloy and copper-printed circuit board was developed. The electroless plating technique was used to develop Ni–P diffusion barrier layer with different percentage of phosphorus content, which are 1–5 wt% (low), 5–8 wt% (medium) and above 8 wt% (high). The results reveal that the high phosphorus content in nickel layer acts as a good diffusion barrier for Sn–4Ag–0.5Cu since it can suppress the intermetallic compound formation. This is because in higher phosphorus content, the grain boundaries were found to be eliminated. Hence, resulted in thinner intermetallic compound thickness. Wessex Institute of Technology 2015 Article PeerReviewed application/pdf en http://umpir.ump.edu.my/id/eprint/11846/1/CMEM030404f.pdf application/pdf en http://umpir.ump.edu.my/id/eprint/11846/7/fkm-2015-aisha-development%20of%20diffusion.pdf Siti Rabiatull Aisha, Idris and Ourdjini, Ali and Azmah Hanim, Mohamad Ariff and Saliza Azlina, Osman (2015) Development of Diffusion Barrier Layer on Copper-Printed Circuit Board Using Electroless Plating Method. International Journal of Computational Methods and Experimental Measurements, 3 (4). pp. 329-339. ISSN 2046-0546 (print); 2046-0554 (online) http://www.witpress.com/elibrary/cmem-volumes/3/4/1056 DOI: 10.2495/CMEM-V3-N4-329-339
repository_type Digital Repository
institution_category Local University
institution Universiti Malaysia Pahang
building UMP Institutional Repository
collection Online Access
language English
English
topic TA Engineering (General). Civil engineering (General)
TN Mining engineering. Metallurgy
spellingShingle TA Engineering (General). Civil engineering (General)
TN Mining engineering. Metallurgy
Siti Rabiatull Aisha, Idris
Ourdjini, Ali
Azmah Hanim, Mohamad Ariff
Saliza Azlina, Osman
Development of Diffusion Barrier Layer on Copper-Printed Circuit Board Using Electroless Plating Method
description In this paper, the nickel–phosphorus (Ni–P) diffusion barrier layer between Sn–4Ag–0.5Cu solder alloy and copper-printed circuit board was developed. The electroless plating technique was used to develop Ni–P diffusion barrier layer with different percentage of phosphorus content, which are 1–5 wt% (low), 5–8 wt% (medium) and above 8 wt% (high). The results reveal that the high phosphorus content in nickel layer acts as a good diffusion barrier for Sn–4Ag–0.5Cu since it can suppress the intermetallic compound formation. This is because in higher phosphorus content, the grain boundaries were found to be eliminated. Hence, resulted in thinner intermetallic compound thickness.
format Article
author Siti Rabiatull Aisha, Idris
Ourdjini, Ali
Azmah Hanim, Mohamad Ariff
Saliza Azlina, Osman
author_facet Siti Rabiatull Aisha, Idris
Ourdjini, Ali
Azmah Hanim, Mohamad Ariff
Saliza Azlina, Osman
author_sort Siti Rabiatull Aisha, Idris
title Development of Diffusion Barrier Layer on Copper-Printed Circuit Board Using Electroless Plating Method
title_short Development of Diffusion Barrier Layer on Copper-Printed Circuit Board Using Electroless Plating Method
title_full Development of Diffusion Barrier Layer on Copper-Printed Circuit Board Using Electroless Plating Method
title_fullStr Development of Diffusion Barrier Layer on Copper-Printed Circuit Board Using Electroless Plating Method
title_full_unstemmed Development of Diffusion Barrier Layer on Copper-Printed Circuit Board Using Electroless Plating Method
title_sort development of diffusion barrier layer on copper-printed circuit board using electroless plating method
publisher Wessex Institute of Technology
publishDate 2015
url http://umpir.ump.edu.my/id/eprint/11846/
http://umpir.ump.edu.my/id/eprint/11846/
http://umpir.ump.edu.my/id/eprint/11846/
http://umpir.ump.edu.my/id/eprint/11846/1/CMEM030404f.pdf
http://umpir.ump.edu.my/id/eprint/11846/7/fkm-2015-aisha-development%20of%20diffusion.pdf
first_indexed 2023-09-18T22:12:51Z
last_indexed 2023-09-18T22:12:51Z
_version_ 1777415143435534336

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