Influence of Second Reflow on the Intermetallic Compound Growth with Different Surface Finish
The formation and growth of the intermetallic were frequently discussed since lead-free solder took place replacing the lead solder. However, the effect of multiple reflow process on the intermetallic morphology that was subjected to aging still needs further investigation. Thus, this study aimed to...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Trans Tech Publications, Switzerland
2016
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| Subjects: | |
| Online Access: | http://umpir.ump.edu.my/id/eprint/15210/ http://umpir.ump.edu.my/id/eprint/15210/ http://umpir.ump.edu.my/id/eprint/15210/1/kahar2016-1.pdf |