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  1. 1
    Development of Diffusion Barrier Layer on Copper-Printed Circuit Board Using Electroless Plating Method
    Development of Diffusion Barrier Layer on Copper-Printed Circuit Board Using Electroless Plating Method
    by Siti Rabiatull Aisha, Idris, Ourdjini, Ali, Azmah Hanim, Mohamad Ariff, Saliza Azlina, Osman
    Published 2015
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  2. 2
    The Mechanical and Microstructural Study of Welded AA7075 Using Different Filler Metals
    The Mechanical and Microstructural Study of Welded AA7075 Using Different Filler Metals
    by M., Ishak, Muhammad Naqiuddin, Mat Salleh, Siti Rabiatull Aisha, Idris
    Published 2017
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Digital Repository 2
Local University 2
Universiti Malaysia Pahang 2
UMP Institutional Repository 2
Siti Rabiatull Aisha, Idris 2 Azmah Hanim, Mohamad Ariff 1 M., Ishak 1 Muhammad Naqiuddin, Mat Salleh 1 Ourdjini, Ali 1 Saliza Azlina, Osman 1
English 2

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